Manufacturing Capabilities

Technical Specification Capability
Lead time 3 days, 5 days, 7 day, 21 Days
Layer count Single Side, Double Side 
Material FR4,MCPCB,CEM-1,FR1
Board Thickness 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.2mm
Max. Dimension 400X500 MM
Finished Outer Layer Copper 1 oz/2 oz/3 oz (35um/70um/105um)
Finished Inner Layer Copper 0.5 oz (17.5um)
Drill Hole Size 0.20mm- 6.30mm
Min. Via hole size 0.2mm
PTH hole Size 0.20mm – 6.35mm
Minimum trace width 5mil (0.127mm) 1 – 2 Layer
Minimum trace width Multi layer 3.5mil (0.09mm) 4 – 6 layel
Dimension Tolerance ±0.2mm
Solder mask color Green, Red, Yellow, Blue, White, and Black.
Surface Finish HAL, ENIG, OSP, Lacquer, Nickel
Legend Colour White, Black, No legend
Cutting option Routing , V-Grooving , Single Pcb
Electrical Testing BBT, FPT
Note: Only working day’s will be counted